Thick Film Technology AND Chip Joining

The book is in good condition with a dust jacket that shows signs of wear, including tears at the top edge. The binding remains strong, and the pages are clean and intact, offering a reliable reading experience despite the jacket's imperfections.

"Thick Film Technology and Chip Joining" by Lewis F. Miller is a comprehensive exploration into the intricacies of thick film technology and its applications in chip joining. Published in 1972 by Gordon and Breach, Science Publishers, Inc., this work is a pivotal resource for professionals and researchers in the fields of electronics and engineering. The book is printed in a sturdy hardcover format, showcasing the expertise of Miller, associated with the International Business Machines Corporation. This edition is an essential reference for those interested in the technological advancements of the early 1970s, offering detailed insights into the manufacturing and application processes. The book's content is particularly significant given its historical context, capturing a moment in technological progress. The dust jacket is present but shows signs of wear, with noticeable tears at the top edge, reflecting its age and use in professional environments.